Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/160355| Author(s): | Beatriz Quezada Mariz Ferreira |
| Title: | Characterization and optimization of warpage in the semiconductor fan-out wafer-level packaging technology |
| Issue Date: | 2024-07-19 |
| Subject: | Engenharia mecânica Mechanical engineering |
| Scientific areas: | Ciências da engenharia e tecnologias::Engenharia mecânica Engineering and technology::Mechanical engineering |
| DOI: | 10.34626/ez7x-rc45 |
| TID identifier: | 203856244 |
| URI: | https://hdl.handle.net/10216/160355 |
| Document Type: | Dissertação |
| Rights: | openAccess |
| Appears in Collections: | FEUP - Dissertação |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 681003.pdf | Characterization and optimization of warpage in the semiconductor fan-out wafer-level packaging technology | 14.54 MB | Adobe PDF |  View/Open |
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