1. Repositório Aberto da Universidade do Porto
  2. FEUP - Faculdade de Engenharia
  3. FEUP - Dissertação
Please use this identifier to cite or link to this item: https://hdl.handle.net/10216/160355
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dc.creatorBeatriz Quezada Mariz Ferreira
dc.date.accessioned2025-11-11T04:10:25Z-
dc.date.available2025-11-11T04:10:25Z-
dc.date.issued2024-07-19
dc.date.submitted2024-07-22
dc.identifier.othersigarra:681003
dc.identifier.urihttps://hdl.handle.net/10216/160355-
dc.language.isoeng
dc.rightsopenAccess
dc.subjectEngenharia mecânica
dc.subjectMechanical engineering
dc.titleCharacterization and optimization of warpage in the semiconductor fan-out wafer-level packaging technology
dc.typeDissertação
dc.contributor.uportoFaculdade de Engenharia
dc.identifier.doi10.34626/ez7x-rc45
dc.identifier.tid203856244
dc.subject.fosCiências da engenharia e tecnologias::Engenharia mecânica
dc.subject.fosEngineering and technology::Mechanical engineering
thesis.degree.disciplineMestrado em Engenharia Mecânica
thesis.degree.grantorFaculdade de Engenharia
thesis.degree.grantorUniversidade do Porto
thesis.degree.level1
rcaap.embargofctPedido de confidencialidade por parte da empresa.
Appears in Collections:FEUP - Dissertação

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