Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/158603| Author(s): | Bruno Miguel Coelho Oliveira |
| Title: | Development of Barrier Layers for Seedless Cu Electroplating |
| Issue Date: | 2024-03-07 |
| Subject: | Engenharia dos materiais Materials engineering |
| Scientific areas: | Ciências da engenharia e tecnologias::Engenharia dos materiais Engineering and technology::Materials engineering |
| DOI: | 10.34626/8kbt-dw92 |
| TID identifier: | 101658842 |
| URI: | https://hdl.handle.net/10216/158603 |
| Document Type: | Tese |
| Rights: | openAccess |
| Appears in Collections: | FEUP - Tese |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 672010.pdf | Development of Barrier Layers for Seedless Cu Electroplating | 23.59 MB | Adobe PDF |  View/Open |
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