Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/101193
Author(s): | Szabolcs Varga Armando C. Oliveira Clito F. Afonso |
Title: | Characterisation of thermal diode panels for use in the cooling season in buildings |
Issue Date: | 2002 |
Abstract: | Thermal diode panels, incorporating heat pipes, were tested under cooling season conditions. Their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. The method allowed the quantification of thermal characteristics for both operating modes: forward and backward heat transfer. Forward heat transfer led to an apparent thermal conductivity up to five times, the one for backward mode. (C) 2002 Elsevier Science B.V. All rights reserved. |
URI: | https://repositorio-aberto.up.pt/handle/10216/101193 |
Document Type: | Artigo em Revista Científica Internacional |
Rights: | restrictedAccess |
Appears in Collections: | FEUP - Artigo em Revista Científica Internacional |
Files in This Item:
File | Description | Size | Format | |
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66231.pdf Restricted Access | 6.57 MB | Adobe PDF | Request a copy from the Author(s) |
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