Characterisation of thermal diode panels for use in the cooling season in buildings

Abstract

Thermal diode panels, incorporating heat pipes, were tested under cooling season conditions. Their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. The method allowed the quantification of thermal characteristics for both operating modes: forward and backward heat transfer. Forward heat transfer led to an apparent thermal conductivity up to five times, the one for backward mode. (C) 2002 Elsevier Science B.V. All rights reserved.