Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/85285
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DC Field | Value | Language |
---|---|---|
dc.creator | Lucas F. M. da Silva | |
dc.creator | Andreas Öchsner | |
dc.creator | Robert D. Adams | |
dc.date.accessioned | 2022-09-16T09:21:11Z | - |
dc.date.available | 2022-09-16T09:21:11Z | - |
dc.date.issued | 2011 | |
dc.identifier.isbn | 978-3-642-01168-9 | |
dc.identifier.other | sigarra:16878 | |
dc.identifier.uri | https://hdl.handle.net/10216/85285 | - |
dc.description.abstract | This introductory chapter gives a brief description of adhesive bonding and adhesion-related phenomena. The major definitions of the terms associated to this technology such as adhesion, cohesion, adhesives, sealants, and adherends are given so that there is uniformity of language throughout the handbook. The reasons that drove the editors to prepare this book are explained. Finally, the organization of the book is described. | |
dc.language.iso | eng | |
dc.relation.ispartof | Handbook of Adhesion Technology | |
dc.rights | openAccess | |
dc.rights.uri | https://creativecommons.org/licenses/by-nc/4.0/ | |
dc.title | Introduction to Adhesive Bonding Technology | |
dc.type | Capítulo ou Parte de Livro | |
dc.contributor.uporto | Faculdade de Engenharia | |
dc.identifier.doi | 10.1007/978-3-642-01169-6_1 | |
dc.identifier.authenticus | P-005-4BP | |
Appears in Collections: | FEUP - Capítulo ou Parte de Livro |
This item is licensed under a Creative Commons License