Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/160352| Author(s): | Pedro Fernandes Couto Videira |
| Title: | Fatigue and fracture in bi-material interfaces of semiconductor devices: Effects of humidity and temperature |
| Issue Date: | 2024-07-22 |
| Subject: | Engenharia mecânica Mechanical engineering |
| Scientific areas: | Ciências da engenharia e tecnologias::Engenharia mecânica Engineering and technology::Mechanical engineering |
| DOI: | 10.34626/121k-sk19 |
| TID identifier: | 203860870 |
| URI: | https://hdl.handle.net/10216/160352 |
| Document Type: | Dissertação |
| Rights: | embargoedAccess |
| Embargo End Date: | 2027-07-21 |
| Appears in Collections: | FEUP - Dissertação |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 680946.pdf Restricted Access | Fatigue and fracture in bi-material interfaces of semiconductor devices: Effects of humidity and temperature | 10.99 MB | Adobe PDF | View/Open |
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