Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/142853| Author(s): | Joana Sofia Moutinho Teixeira |
| Title: | Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth |
| Issue Date: | 2022-07-18 |
| Subject: | Engenharia química Chemical engineering |
| Scientific areas: | Ciências da engenharia e tecnologias::Engenharia química Engineering and technology::Chemical engineering |
| DOI: | 10.34626/4aaw-2992 |
| TID identifier: | 203167007 |
| URI: | https://hdl.handle.net/10216/142853 |
| Document Type: | Dissertação |
| Rights: | restrictedAccess |
| Appears in Collections: | FEUP - Dissertação |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 572465.pdf | Copper electroplating for wafer level packaging. Study of plating suppressor and electrolyte working time on copper nucleation and growth | 2.81 MB | Adobe PDF |  View/Open |
| 572465.1.pdf Restricted Access | Copper electroplating for wafer-level packaging. Study of plating suppressor and electrolyte working time on copper nucleation and growth | 2.95 MB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.