Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth

Please use this identifier to cite or link to this item: https://hdl.handle.net/10216/142853

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DC Field	Value	Language
dc.creator	Joana Sofia Moutinho Teixeira
dc.date.accessioned	2025-11-06T16:51:00Z	-
dc.date.available	2025-11-06T16:51:00Z	-
dc.date.issued	2022-07-18
dc.date.submitted	2022-08-04
dc.identifier.other	sigarra:572465
dc.identifier.uri	https://hdl.handle.net/10216/142853	-
dc.language.iso	eng
dc.rights	restrictedAccess
dc.subject	Engenharia química
dc.subject	Chemical engineering
dc.title	Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth
dc.type	Dissertação
dc.contributor.uporto	Faculdade de Engenharia
dc.identifier.doi	10.34626/4aaw-2992
dc.identifier.tid	203167007
dc.subject.fos	Ciências da engenharia e tecnologias::Engenharia química
dc.subject.fos	Engineering and technology::Chemical engineering
thesis.degree.discipline	Mestrado em Engenharia Química
thesis.degree.grantor	Faculdade de Engenharia
thesis.degree.grantor	Universidade do Porto
thesis.degree.level	1
rcaap.embargofct	Confidencialidade empresarial
Appears in Collections:	FEUP - Dissertação

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File	Description	Size	Format
572465.pdf	Copper electroplating for wafer level packaging. Study of plating suppressor and electrolyte working time on copper nucleation and growth	2.81 MB	Adobe PDF	View/Open
572465.1.pdf Restricted Access	Copper electroplating for wafer-level packaging. Study of plating suppressor and electrolyte working time on copper nucleation and growth	2.95 MB	Adobe PDF	View/Open