Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/139337| Author(s): | João Pedro dos Santos Cardoso |
| Title: | Investigação Experimental do Warpage e Rigidez em Wafers WLP de 300 mm |
| Issue Date: | 2021-12-16 |
| Subject: | Ciências exactas e naturais Natural sciences |
| Scientific areas: | Ciências exactas e naturais Natural sciences |
| DOI: | 10.34626/6dxr-0197 |
| URI: | https://hdl.handle.net/10216/139337 |
| Document Type: | Relatório de Estágio |
| Rights: | openAccess |
| Appears in Collections: | FCUP - Relatório de Estágio |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 527346.pdf | Investigação Experimental do Warpage e Rigidez em Wafers WLP de 300 mm | 7.55 MB | Adobe PDF |  View/Open |
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