Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/136760| Author(s): | Liliane Cristina Gonçalves Savaris |
| Title: | Novel diffusion barrier layers for advanced copper interconnect metallization |
| Issue Date: | 2021-10-07 |
| Subject: | Engenharia dos materiais Materials engineering |
| Scientific areas: | Ciências da engenharia e tecnologias::Engenharia dos materiais Engineering and technology::Materials engineering |
| DOI: | 10.34626/f9v9-tf07 |
| TID identifier: | 202822397 |
| URI: | https://hdl.handle.net/10216/136760 |
| Document Type: | Dissertação |
| Rights: | openAccess |
| Appears in Collections: | FEUP - Dissertação |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 505681.pdf | Novel diffusion barrier layers for advanced copper interconnect metallization | 4.89 MB | Adobe PDF |  View/Open |
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