Please use this identifier to cite or link to this item: https://hdl.handle.net/10216/127769
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dc.creatorSimoes, S
dc.creatorM. Silva Jr
dc.creatorA. S. Ramos
dc.creatorM. T. Vieira
dc.creatorVieira, MF
dc.creatorFilomena Viana
dc.date.accessioned2022-09-10T18:50:08Z-
dc.date.available2022-09-10T18:50:08Z-
dc.date.issued2019
dc.identifier.othersigarra:406167
dc.identifier.urihttps://hdl.handle.net/10216/127769-
dc.language.isopor
dc.rightsopenAccess
dc.titleM. Silva Jr., A.S. Ramos, F. Viana, M.T. Vieira, M.F. Vieira, S. Simões. "The use of Ni/Al nanolayers in the diffusion bonding of Ti6Al4V to Al2O3" AJP 2019, 1st International Conference on Advanced Joining Processes, 24-25 October, Ponta Delgada, Azores, Portugal, 2019
dc.typePoster em Conferência Internacional
dc.contributor.uportoFaculdade de Engenharia
Appears in Collections:FEUP - Poster em Conferência Internacional

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