Please use this identifier to cite or link to this item: https://hdl.handle.net/10216/106720
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dc.creatorOlívia Soares
dc.creatorFernando Pereira
dc.creatorJosé Órfão
dc.creatorJoaquim Luís Faria
dc.creatorCláudia Silva
dc.date.accessioned2019-05-09T23:07:37Z-
dc.date.available2019-05-09T23:07:37Z-
dc.date.issued2014
dc.identifier.issn1385-8947
dc.identifier.othersigarra:105861
dc.identifier.urihttps://hdl.handle.net/10216/106720-
dc.description.abstractThe extension of photocatalytic nitrate reduction in water by a 1%Pd-1%Cu (%wt) catalyst supported on TiO2 was evaluated under different reaction conditions. A series of electron sacrificial donors such as formic acid, oxalic acid, ethanol, methanol, and humic acid were used for inhibiting the mechanism of electron/hole recombination on the semiconductor by hole scavenging. In addition, the roles of H-2 as reducing agent and CO2 as buffer are also discussed. The photocatalytic process is found to be more selective towards nitrogen than the dark catalytic process. Hole scavengers, or reducing H-2 increase significantly the photocatalytic reduction of nitrate. Complete (100%) conversion was obtained when both H-2 and CO2 were used as reducing and buffer agent, respectively. Among the hole scavengers tested, 0.08 M formic acid solution represents the best compromise between nitrate conversion (84%) and nitrogen selectivity (83%).
dc.language.isoeng
dc.relationinfo:eu-repo/grantAgreement/FCT - Fundação para a Ciência e Tecnologia/Projetos Estratégicos/PEst-C/EQB/LA0020/2013/PROJECTO ESTRATÉGICO - LA 20 - 2013-2014/LA 20
dc.rightsrestrictedAccess
dc.subjectQuímica, Engenharia química
dc.subjectChemistry, Chemical engineering
dc.titlePhotocatalytic nitrate reduction over Pd-Cu/TiO2
dc.typeArtigo em Revista Científica Internacional
dc.contributor.uportoFaculdade de Engenharia
dc.identifier.doi10.1016/j.cej.2014.04.030
dc.identifier.authenticusP-009-CWA
dc.subject.fosCiências da engenharia e tecnologias::Engenharia química
dc.subject.fosEngineering and technology::Chemical engineering
Appears in Collections:FEUP - Artigo em Revista Científica Internacional

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