Utilize este identificador para referenciar este registo: https://hdl.handle.net/10216/100003
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Campo DCValorIdioma
dc.creatorF. J. G. Silva
dc.creatorA. J. S. Fernandes
dc.creatorF. M. Costa
dc.creatorA. P. M. Baptista
dc.creatorE. Pereira
dc.date.accessioned2022-09-07T19:20:38Z-
dc.date.available2022-09-07T19:20:38Z-
dc.date.issued2005
dc.identifier.issn0257-8972
dc.identifier.othersigarra:55233
dc.identifier.urihttps://hdl.handle.net/10216/100003-
dc.description.abstractAlthough the direct deposition of CVD diamond coatings on ferrous substrates is highly desirable, many technological problems hinder the production of commercial applications, mainly due to a lack of adhesion. Diamond can be grown on such substrates; however, film detachment cannot usually be avoided. Suitable buffer layers are the most commonly used solution to overcome adhesion problems. In the present work, we report CVD diamond deposition on steel substrates pre-coated with a multilayer composed of Ni/Cu with embedded diamond particles. With this interlayer a range of diamond film growth parameters were found to give crack-free and nearly strain-free diamond continuous coatings. Film morphology and quality are assessed by scanning electron microscopy (SEM), profilometry, and micro-Raman spectroscopy. The adhesion of the films is strong enough to with stand micro-abrasion tests. (C) 2004 Elsevier B.V All rights reserved.
dc.language.isoeng
dc.rightsrestrictedAccess
dc.subjectTecnologia de materiais, Engenharia dos materiais
dc.subjectMaterials technology, Materials engineering
dc.titleUnstressed PACVD diamond films on steel pre-coated with a composite multilayer
dc.typeArtigo em Revista Científica Internacional
dc.contributor.uportoFaculdade de Engenharia
dc.identifier.doi10.1016/j.surfcoat.2004.02.036
dc.identifier.authenticusP-000-4ZA
dc.subject.fosCiências da engenharia e tecnologias::Engenharia dos materiais
dc.subject.fosEngineering and technology::Materials engineering
Aparece nas coleções:FEUP - Artigo em Revista Científica Internacional

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