Please use this identifier to cite or link to this item:
https://hdl.handle.net/10216/125607| Author(s): | Sílvia C. Pinho Belmira Neto J.O. Dias |
| Title: | LIFE CYCLE ASSESSMENT APPLIED TO THE PHYSICAL PROCESS TO RECOVERY COPPER FROM PRINTED CIRCUIT BOARD |
| Issue Date: | 2019-09-04 |
| Subject: | Ciências Tecnológicas Technological sciences |
| URI: | https://hdl.handle.net/10216/125607 |
| Document Type: | Poster em Conferência Internacional |
| Rights: | restrictedAccess |
| Appears in Collections: | FEUP - Poster em Conferência Internacional |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 353248.pdf Restricted Access | LCA applied to physical processes used to recover copper from printed circuit boards | 79.7 kB | Adobe PDF | Request a copy from the Author(s) |
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